Patent Approved!
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Patent Approved!

Dr. Wasif Tanveer Khan, an Assistant Professor at Department of Electrical Engineering, LUMS just got his invention patented, which will enable integration of antennas in embedded wafer level package with higher efficiency! His patent application has been approved by US Patent Office (US Patent Number 10541464). We are thrilled to share this announcement with you!

emWLB is a technology that enables the integration of RFICs/MMICs, passive components and antennas at mm-wave frequencies (30-300GHz) with smaller interconnect loss compared to Flip Chip and wire bond technologies. Dr. Wasif and his team have patented a microwave antenna coupling apparatus that rivals contemporary antenna technologies that have narrower operating bandwidth and suffers from radiation pattern having ripples due to the nature of their design (presence of a thick mold compound). In this invention, a new way of embedding antennas in emWLB package along with various chips has been claimed with relatively better antenna performance. A few antenna coupling techniques in emWLB have also been claimed in this patent.

What’s the big deal with microwaves, you ask? RF/Microwaves are everywhere and you probably would not have been able to read this article without information packets hitching a ride on them! (aka, your Wi-Fi). We use them to make calls and use internet on the go. However, you may have heard of 5G Communication. This is a technology that uses millimeter-wave frequencies and massive MIMO (Multiple Input, Multiple Output) technology and requires multiple antennas to be packed in a smaller form factor with higher efficiency. Automotive Radars at 77 GHz is another area where this technology can be effectively used. The antennas and antenna coupling techniques resulting from this patent will pave the way to design various types of antennas in embedded Wafer Level Packaging Technology at mm-wave frequencies.

This work was sponsored by Sony GmbH and the IP was developed at LUMS. LUMS, through an agreement, transferred the IP to Sony GmbH so that it can be used in their products.

Congratulations to Dr. Wasif and his team for getting their patent approved and issued by US Patent Office!